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I think that's called "throwing money at the problem"!

Taping the coin (or heat sink) down should give you better heat transfer, therefore better cooling.

Designing your own case in OpenSCAD and 3D printing is a piece of cake, building a large fan into the case (lower noise) is a nice weekend project.



A bit of thermal paste between the chip and the coin would also help with heat transfer


Paste between coins with a stacking arrangement going big-small-big-small etc so that there was a semblance of fins would be interesting.


This sounds like a job for the trusty denizen of the homebuilt computer builder’s toolbox, thermal paste!




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