Has chip aging finally surpassed thermal cycling as the primary cause of compone... | Hacker News

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		AlotOfReading 5 months ago \| parent \| context \| favorite \| on: The Unsustainability of Moore's Law Has chip aging finally surpassed thermal cycling as the primary cause of component failure in datacenters?

wmf 5 months ago [–]

I don't know but I would guess not. Solder is really weak compared to silicon.

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