Yes, they should charge Apple 30% of their revenue.
Also, they should insist to change "Made in China, designed in California" into "Made in China, High-tech from Taiwan, rest of the design from California".
If they don't comply, Apple should be thrown out of the FabStore.
ASML is making more than "just light sources". (indeed the "light source" part of their photolitography machines is something they bought a company from the US for - the entire industry has supply chains spanning the world, so attributing it to countries makes not that much sense IMHO)
>Also, they should insist to change "Made in China, designed in California" into "Made in China, High-tech from Taiwan, rest of the design from California".
Cambridge, England (Arm) should also be in this mix.
It does seem like TSMC has strong leverage since it would take Apple a lot of time and work to move to a competitor.
On the other hand, the incentives seem pretty well aligned. TSMC presumably makes a lot of money when Apple is successful and sells a lot of chips. Having a customer that is demanding and willing to pay for huge volumes of bleeding edge parts helps TSMC build on their lead. Having early access to the best process helps Apple differentiate, and their business model gives them the margins to afford all of this.
Anyway, I don't see why either side would want to really change this setup.
They can do it for a time.
Apple can then use some of the hundreds of billions they have on hand to prop up one of TSMC's competitors, as they did with the RAM suppliers.
Who, Samsung? Somehow I don't see Apple doing that. It's not a particularly populous industry; no other foundry (ignoring the blacklisted Chinese companies) but Samsung, TSMC, and Intel is involved in sub-10nm lithography, to my knowledge.
ASML sells the complete EUV lithography machine. Zeiss is one of their partners that supplies the optics. Trumpf makes the pulsed lasers which turn tin droplets into plasma which then produces the EUV light. They say they have many more research and supply partners, but those are the ones that I've found mentioned by name in press releases.
Do they design the actual tin droplet plasma chamber thing, or are they essentially a systems integrator from a bunch of suppliers putting it all together into their overall design to their specs?
This question doesn't make sense, both options involve designing the thing.
Anyway, it's not even about designing it. The technology had to be invented first. It would be crazy to use exploding metal drops in a vacuum chamber where you want to manufacture microchips if there were any other options but there were zero options before. There are few applications of EUV in general, and currently only one at those luminosity levels. So R&D is a big component here, not just manufacturing. And even if we only look at the manufacturing part, this isn't some "simple" vacuum chamber gadget either, only ~30 machines were built last year and they cost more than 100M$ each.
For comparison, four of these cost as much as one Wendelstein-7X. This is more of a big, barely productized science project shipped out as soon as it works just good enough for the chip manufacturers.
It could be some module within the vacuum chamber that has other uses and was already made by someone else for e.g. scientific experiment uses or something; I'm just asking if that part is made in house or is from another supplier.